Interposer Series
Interposer
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Features and Benefits
- Solderless interposer
- Board to Board or Board to Cable applications
- Spring load contacts
- Starclip Contacts technology
- Compliant to CS FR051 C&K specification
- Possibility to customize the interposer (Sealing ring cavity, bracket, thread…)
Typical Applications
- Space equipements
- Military and avionics
- Satellites payloads
- Engineering
Specifications
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Contact Resistance (Rated Current):
25 mΩ max
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Insulation Resistance (500 VDC):
5000 MΩ min
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Voltage Proof:
400/800 Vrms / 1.0 mA leakage current
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Rated Current:
1.5 A
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Temperature Range:
-55°C to 125°C
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Working Voltage:
100/200 Vrms